Semiconductor device and manufacturing method thereof

ABSTRACT

A semiconductor device includes a semiconductor substrate, an isolation structure, and a spacer. The semiconductor substrate includes at least one fin structure. The isolation structure is partly disposed in the fin structure and partly disposed above the fin structure. The fin structure includes a first fin and a second fin elongated in the same direction. A part of the isolation structure is disposed between the first fin and the second fin in the direction where the first fin and the second fin are elongated. The spacer is disposed on sidewalls of the isolation structure on the fin structure. The isolation structure in the present invention is partly disposed in the fin structure and partly disposed above the fin structure. The negative influence of a gate structure formed on the isolation structure and sinking into the isolation structure on the isolation performance of the isolation structure may be avoided accordingly.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to a semiconductor device and amanufacturing method thereof, and more particularly, to a semiconductordevice including an isolation structure partly disposed in a finstructure and partly disposed on the fin structure and a manufacturingmethod thereof.

2. Description of the Prior Art

The development of semiconductor integrated circuit technologyprogresses continuously and circuit designs in products of the newgeneration become smaller and more complicated than those of the formergeneration. The amount and the density of the functional devices in eachchip region are increased constantly according to the requirements ofinnovated products, and the size of each device has to become smalleraccordingly. For operating the integrated circuit devices of differentfunctions independently or cooperatively, an effective electricalisolation design is required to electrically isolating some of theintegrated circuit devices from one another for preventing unwantedelectrical coupling and/or unwanted electrical influence betweenadjacent components and devices. Therefore, for the related fields andindustries, it is very important to improve the design of the electricalisolation structure integrated in the advanced process under the requestfor enhancing the integrity continuously.

SUMMARY OF THE INVENTION

A semiconductor device and a manufacturing method thereof are providedin the present invention. An isolation structure partly disposed in afin structure and partly disposed on the fin structure is used toprovide an isolation effect between different regions in the finstructure. A spacer is formed on sidewalls of the isolation structure onthe fin structure, and there is no need to form a gate structure on theisolation structure. Negative influence of the gate structure formed onthe isolation structure or sinking into the isolation structure on theisolation performance of the isolation structure may be avoidedaccordingly.

According to an embodiment of the present invention, a semiconductordevice is provided. The semiconductor device includes a semiconductorsubstrate, an isolation structure, and a spacer. The semiconductorsubstrate includes at least one fin structure. The isolation structureis partly disposed in the fin structure and partly disposed on the finstructure. The fin structure includes a first fin and a second fin. Thefirst fin and the second fin are elongated in a same direction, and apart of the isolation structure is disposed between the first fin andthe second fin in the direction where the first fin and the second finare elongated. The spacer is disposed on sidewalls of the isolationstructure disposed on the fin structure.

According to an embodiment of the present invention, a manufacturingmethod of a semiconductor device is provided. The manufacturing methodincludes the following steps. A semiconductor substrate is provided, andthe semiconductor substrate includes at least one fin structure. Apatterned mask layer is formed on the fin structure. The patterned masklayer includes an opening corresponding to a part of the fin structurein a vertical direction. An etching process with the patterned masklayer as a mask is performed for forming a trench in the fin structure.A pullback process is performed to the patterned mask layer forenlarging the opening of the patterned mask layer. An isolationstructure is formed in the trench and the enlarged opening of thepatterned mask layer.

In the semiconductor device and the manufacturing method thereof in thepresent invention, the pullback process is used to enlarging the openingof the patterned mask layer after the step of forming the trench in thefin structure by the opening of the patterned mask layer, and theisolation structure is formed in the trench and the enlarged opening. Inthe isolation structure, a part formed on the fin structure may beformed and self-aligned with a part formed in the trench (i.e. a partformed in the fin structure), and the isolation structure partly formedin the fin structure and partly formed on the fin structure as requiredmaybe obtained accordingly.

These and other objectives of the present invention will no doubt becomeobvious to those of ordinary skill in the art after reading thefollowing detailed description of the preferred embodiment that isillustrated in the various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1-11 are schematic drawings illustrating a manufacturing method ofa semiconductor device according to an embodiment of the presentinvention, wherein

FIG. 2 is a cross-sectional diagram taken along a line A-A′ in FIG. 1,

FIG. 3 is a schematic drawing in a step subsequent to FIG. 2,

FIG. 4 is a schematic drawing in a step subsequent to FIG. 3,

FIG. 5 is a schematic drawing in a step subsequent to FIG. 4,

FIG. 6 is a schematic drawing in a step subsequent to FIG. 5,

FIG. 7 is a schematic drawing in a step subsequent to FIG. 6,

FIG. 8 and FIG. 9 are schematic drawings in a step subsequent to FIG. 7,

FIG. 8 is a cross-sectional diagram taken along a line B-B′ in FIG. 9,

FIG. 10 and FIG. 11 are schematic drawings in a step subsequent to FIG.8 and FIG. 9, and

FIG. 10 is a cross-sectional diagram taken along a line C-C′ in FIG. 11.

DETAILED DESCRIPTION

Please refer to FIGS. 1-11. FIGS. 1-11 are schematic drawingsillustrating a manufacturing method of a semiconductor device accordingto an embodiment of the present invention. FIG. 1, FIG. 9, and FIG. 11are top-view diagrams. FIGS. 2-8 and FIG. 10 are cross-sectionaldiagrams. FIG. 2 is a cross-sectional diagram taken along a line A-A′ inFIG. 1, FIG. 8 is a cross-sectional diagram taken along a line B-B′ inFIG. 9, and FIG. 10 is a cross-sectional diagram taken along a line C-C′in FIG. 11. The manufacturing method of the semiconductor device in thisembodiment includes the following steps. As shown in FIG. 1 and FIG. 2,a semiconductor substrate 10 is provided. The semiconductor substrate 10in this embodiment may include a silicon substrate, an epitaxial siliconsubstrate, a silicon germanium substrate, a silicon carbide substrate,or a silicon-on-insulator (SOI) substrate, but not limited thereto. Thesemiconductor substrate 10 includes at least one fin structure 10F, andthe fin structure 10F includes a fin-shaped structure made of asemiconductor material. In this embodiment, the semiconductor substrate10 may include a plurality of the fin structures 10F. Each of the finstructures 10F is elongated in a first direction D1, and the finstructures 10F are repeatedly disposed in a second direction D2. Thefirst direction D1 may be substantially orthogonal to the seconddirection D2, but not limited thereto. The fin structures 10F may beformed by performing a patterning process, such as a multiple patterningprocess, to the semiconductor substrate 10. The fin structures 10F maybe separated from one another by a shallow trench isolation (STI)structure 20. The shallow trench isolation structure 20 may be composedof a single layer or multiple layers of insulation materials, such as anoxide insulation material, but not limited thereto.

A patterned mask layer 30 is then formed on the fin structures 10F. Thepatterned mask layer 30 includes an opening H corresponding to a part ofthe fin structure 10F in a vertical direction D3. In some embodiments ofthe present invention, a first liner 21 may be selectively formed on thesemiconductor substrate 10 before the patterning process performed tothe semiconductor substrate 10 for forming the fin structures 10F, and asecond liner 22 may be selectively formed on the first liner 21 and theshallow trench isolation 20 after the steps of forming the finstructures 10F and the shallow trench isolation 21 and before the stepof forming the patterned mask layer 30. The first liner 21 and thesecond liner 22 may be formed by insulation materials, such as oxideinsulation materials, respectively for providing a protection effectduring other processes. However, in some embodiments, the opening H ofthe patterned mask layer 30 may directly expose a part of the finstructure 10F without forming the first liner 21 and the second liner 22mentioned above. In other words, regardless of forming the first liner21 and the second liner 22 mentioned above or not, the opening H of thepatterned mask layer 30 is formed corresponding to a part of the finstructure 10F in the vertical direction D3 for forming a trench in thefin structure 10F by a subsequent etching process. In some embodiments,the opening H of the patterned mask layer 30 may be elongated in thesecond direction D2 for being corresponding to a plurality of the finstructures 10F, but not limited thereto. The material of the patternedmask layer 30 may include silicon nitride or other appropriateinsulation materials. The patterned mask layer 30 maybe formed by aphoto etching process, a photo patterning process, or other suitableprocesses.

As shown in FIG. 3, an etching process 91 with the patterned mask layer30 as a mask is performed for removing a part of the fin structure 10Fcorresponding to the opening H (may also be regarded as etching the finstructure 10F which is not covered by the patterned mask layer 30) andforming a trench TR in the fin structure 10F. A depth of the trench TRmay be less than or equal to a depth of the shallow trench isolation 20preferably, and a lowermost surface of the trench TR is higher than orsubstantially equal to a lowermost surface of the shallow trenchisolation 20 preferably, but not limited thereto. Additionally, theetching process 91 may include one etching step or more etching stepswith different process conditions for etching the first liner 21, thesecond liner 22, and the fin structure 10F respectively. The etchingprocess 91 may include an anisotropic etching process preferably, suchas an anisotropic dry etching process, for forming the trench TR havinga higher aspect ratio, but not limited thereto. In addition, the finstructure 10F is cut by the trench TR and divided into a first fin F1and a second fin F2. The first fin F1 and the second fin F2 areelongated in the same direction, and the trench TR is located betweenthe first fin F1 and the second fin F2 of the same fin structure 10F.

As shown in FIG. 3 and FIG. 4, a pullback process 92 is performed to thepatterned mask layer 30 for enlarging the opening H of the patternedmask layer 30, and the opening H is converted into an enlarged openingH′ by the pullback process 92. In some embodiments, the pullback process92 may include a wet etching process or other processes having higheretching selectivity between the patterned mask layer 30 and othermaterial layers for avoiding the influence on the shape and the size ofthe trench TR formed before the pullback process 92. In addition, awidth W2 of the enlarged opening H′ is larger than a width W1 of thetrench TR, and the enlarged opening H′ may be formed self-aligned withthe trench TR by the pullback process 92 mentioned above. In someembodiments of the present invention, the enlarged opening may also beformed by other approaches, such as another photo etching process, butthe alignment variation between the trench TR and the opening may becomelarger accordingly.

As shown in FIG. 5, an isolation structure 40S is then formed in thetrench TR and the enlarged opening H′ of the patterned mask layer 30.The method of forming the isolation structure 40S may include but is notlimited to the following steps. An isolation material layer 40 may beformed in the trench TR, in the enlarged opening H′ of the patternedmask layer 30, and on the patterned mask layer 30. The trench TR and theenlarged opening H′ are filled with the isolation material layer 40.Subsequently, a planarization process is performed to remove theisolation material layer 40 on the patterned mask layer 30 for formingthe isolation structure 40S. The isolation structure 40S may include afirst part P1 formed in the fin structure 10F (i.e. formed in the trenchTR) and a second part P2 forming on the first part P1 and the finstructure 10F because the isolation structure 40S is formed by fillingthe trench TR and the enlarged opening H′ with the isolation materiallayer 40. The second part P2 is directly connected with the first partP1. The isolation material layer 40 may include insulation materials,such as an oxide insulation material, or other suitable materials. Theisolation material layer 40 may be formed by a process such as aflowable chemical vapor deposition (FCVD) process for ensuring that thetrench TR and the enlarged opening H′ are filled with the isolationmaterial layer 40 effectively, but not limited thereto. In addition, ananneal process may be performed for forming the isolation structure 40Safter the FCVD process of forming the isolation material layer 40. Inthe isolation structure 40S formed by the method described above, awidth of the first part P1 will be less than a width of the second partP2, and the second part P2 may also be regarded as being formedself-aligned with the first part P1. Accordingly, the first part P1 isformed between the first fin F1 and the second fin F2, and the secondpart P2 is formed on the first fin F1 and the second fin F2simultaneously. Additionally, it is worth noting that a required heightof the second part P2 of the isolation structure 40S may be obtained bycontrolling the thickness of the patterned mask layer 30 because theisolation structure 40S may be formed by filling the trench TR and theenlarged opening H′ with the isolation material layer 40.

As shown in FIGS. 5-7, the patterned mask layer 30 is removed, and aprocess, such as a recessing process, may be performed to remove a partof the shallow trench isolation 20, a part of the first liner 21, and apart of the second liner 22 for exposing side surfaces and a part of atop surface TS of each fin structure 10F. After the recessing processmentioned above, a top surface of the shallow trench isolation 20 formedbetween the fin structures 10F is lower than the top surface TS of eachof the fin structures 10F, and a top surface of the isolation structure10F is higher than the top surface TS of each of the fin structures 10F.Additionally, a part of the first liner 21 and a part of the secondliner 22 may remain between the second part P2 of the isolationstructure 40S and the first fin F1 and remain between the second part P2of the isolation structure 40S and the second fin F2 after the recessingprocess mentioned above.

As shown in FIG. 8 and FIG. 9, at least one gate structure 50 maybeformed straddling the fin structure 10F. For example, the gate structure50 may be elongated in the second direction D2, cross a plurality of thefin structures 10F, and be formed straddling the fin structures 10F.Therefore, the gate structure 50 may contact the top surface and twoside surfaces of the fin structure 10F crossed by the gate structure 50,but not limited thereto. Additionally, in some embodiments, a pluralityof the gate structures 50 may be formed separately from one another andparallel to one another, and the isolation structure 40S may be disposedparallel to the gate structures 50 also, but not limited thereto. Forexample, the gate structures 50 mentioned above may include a first gatestructure 51, a second gate structure 52 and a third gate structure 53disposed separately from one another and parallel to one another. Thefirst gate structure 51 is formed straddling a plurality of the firstfins F1, and the second gate structure 52 is formed straddling aplurality of the second fins F2. The isolation structure 40S is locatedbetween the first gate structure 51 and the second gate structure 52,and the second part P2 of the isolation structure 40S covers one end ofthe first fins F1 and one end of the second fins F2 in the verticaldirection D3. Additionally, the third gate structure 53 maybe formed atan end of each of the first fins F1 while the isolation structure 40S isformed at another end of each of the first fins F1 in the firstdirection D1, or be formed at an end of each of the second fins F2 whilethe isolation structure 40S is formed at another end of each of thesecond fins F2 in the first direction D1, and the third gate structure53 maybe regarded as a dummy gate structure, but not limited thereto. Insome embodiments, the first gate structure 51 and the second gatestructure 52 may be gate electrodes of different fin type semiconductorunits respectively, and the first gate structure 51 and the second gatestructure 52 may include conductive materials accordingly, but notlimited thereto. However, in some embodiments, the first gate structure51, the second gate structure 52, and the third gate structure 53 may bedummy gate structures for a replacement metal gate (RMG) processperformed subsequently, and the materials of the first gate structure51, the second gate structure 52, and the third gate structure 53 mayinclude semiconductor materials such as amorphous silicon orpolysilicon, but not limited thereto.

As shown in FIG. 10 and FIG. 11, a spacer 60S may be formed on sidewallsSW1 of the second part P2 of the isolation structure 40S and sidewallsSW2 of the gate structures 50. The method of forming the spacer 60S mayinclude but is not limited to the following steps. For example, a spacermaterial layer 60 may be formed conformally on the surfaces of the gatestructures 50, the isolation structure 40S, and the fin structures 10Ffirst, and an anisotropic etching process may then be performed toremove a part of the spacer material layer 60 for forming the spacer 60Son the sidewalls SW1 of the isolation structure 40S and the sidewallsSW2 of the gate structures 50. The spacer material layer 60 may includeoxide, nitride, oxynitride, or other suitable insulation materials, andthe spacer 60S may be composed of a single spacer material layer ormultiple spacer material layers. Subsequently, a plurality ofsource/drain regions 70 may be formed in the fin structures 10F, andeach of the source/drain regions 70 is at least partially formed in thecorresponding fin structure 10F. For example, each of the source/drainregions 70 may include an epitaxial structure extending upwards andbeyond the top surface TS of the fin structure 10F, but not limitedthereto. Additionally, a part of the source/drain regions 70 may beformed at two opposite sides of the first gate structure 51 in the firstdirection D1, and the other part of the source/drain regions 70 may beformed at two opposite sides of the second gate structure 52 in thefirst direction D1. Therefore, some of the source/drain regions 70 maybeformed in the fin structure 10F between the isolation structure 40S andthe gate structures 50, and each of these source/drain regions 70 maydirectly contact the spacer 60S formed on the sidewall SW1 of the secondpart P2 of the isolation structure 40S and the spacer 60S formed on thesidewall SW2 of the corresponding gate structure 50, but not limitedthereto.

After the step of forming the source/drain regions 70, an interlayerdielectric 80 may be formed to cover the isolation structure 40S and thesource/drain regions 70, and top surfaces of the gate structures 50 maynot be covered by the interlayer dielectric 80 for forming metal gatestructures (not shown) at the locations of the gate structures 50 byperforming a replacement metal gate process to the gate structures 50subsequently. In other words, the interlayer dielectric 80 covers theisolation structure 40S during the replacement metal gate process. Thereis no need to formed the gate structure 50 on the isolation structure40S because the second part P2 of the isolation structure 40S is formedabove the top surface TS of the fin structure 10F and may be used toformed the spacer 60S required in the subsequent process of forming thesource/drain regions 70. The negative influence of the gate structure onthe isolation performance of the isolation structure 70 may be avoidedaccordingly. For example, when the isolation structure 40S is composedof the first part P1 disposed in the fin structure 10F without thesecond part P2 disposed on the fin structure 10F, a gate structure hasto be formed on the first part P1 and a spacer has to be formed onsidewalls of the gate structure for the subsequent process of thesource/drain regions 70. However, negative influence may be generated bythe gate structure formed on the isolation structure especially when thegate structure partially sinks into the isolation structure, and theisolation performance of the isolation structure will be affectedaccordingly. In other words, there is no need to formed a gate structureon the isolation structure 40S in the present invention because theisolation structure 40S is partly formed in the fin structure 10F andpartly formed on the fin structure 10F, and the isolation effect of theisolation structure 40S for isolating the first fin F1 from the secondfin F2 may be ensured accordingly.

After the manufacturing method described above, a semiconductor device100 shown in FIG. 10 and FIG. 11 may be formed. The semiconductor device100 includes the semiconductor substrate 10, the isolation structure40S, and the spacer 60S. The semiconductor substrate 10 includes atleast one fin structure 10F. The isolation structure 40S is partlydisposed in the fin structure 10F and partly disposed on the finstructure 10F. The fin structure 10F includes a first fin F1 and asecond fin F2. The first fin F1 and the second fin F2 are elongated in asame direction (such as the first direction D1 shown in FIG. 11), and apart of the isolation structure 40S is disposed between the first fin F1and the second fin F2 in the direction where the first fin F1 and thesecond fin F2 are elongated. The spacer 60S is disposed on the sidewallsSW1 of the isolation structure 40S disposed on the fin structure 10F.

Additionally, the semiconductor device 100 may further include aplurality of the gate structures 50, such as the first gate structure51, the second gate structure 52, and the third gate structure 53. Thefirst gate structure 51, the second gate structure 52, and the thirdgate structure 53 are disposed and elongated in the second direction D2.The top surface of the gate structure 50 is higher than or located onthe same level with the top surface of the isolation structure 40S inthe vertical direction D3 preferably, but not limited thereto. The firstgate structure 51 is disposed on the first fin F1 and disposedstraddling the first fin F1. The second gate structure 52 is disposed onthe second fin F2 and disposed straddling the second fin F2. Theisolation structure 40S is disposed between the first fin F1 and thesecond fin F2 in the first direction D1. The isolation structure 40S,the first gate structure 51, the second gate structure 52, and the thirdgate structure 53 may be disposed parallel to one another. Each of thegate structures 50 may include a gate dielectric layer (not shown)disposed at a side adjacent to the fin structure. In addition, thespacer 60S may be further disposed on the sidewalls of the first gatestructure 51 and the sidewalls of the second gate structure 52, and thesemiconductor device 100 may further include a plurality of thesource/drain regions 70. Each of the source/drain regions 70 is at leastpartially disposed in the fin structure 10F. A part of the source/drainregions 70 are disposed at two opposite sides of the first gatestructure 51 in the direction where the first fin F1 and the second finF2 are elongated (such as the first direction D1 shown in FIG. 11), andthe other part of the source/drain regions 70 are disposed at twoopposite sides of the second gate structure 52 in the direction wherethe first fin F1 and the second fin F2 are elongated. Some of thesource/drain regions 70 are disposed between the isolation structure 40Sand the first gate structure 51 in the direction where the first fin F1and the second fin F2 are elongated or disposed between the isolationstructure 40S and the second gate structure 52.

In some embodiments, the first gate structure 51 (or the metal gatestructure formed at the location of the first gate structure 51 by thereplacement metal gate process), the first fin F1, and the source/drainregions 70 disposed in the first fin F1 at two sides of the first gatestructure 51 may form a first semiconductor unit T1. The second gatestructure 52 (or the metal gate structure formed at the location of thesecond gate structure 52 by the replacement metal gate process), thesecond fin F2, and the source/drain regions 70 disposed in the secondfin F2 at two sides of the second gate structure 52 may form a secondsemiconductor unit T2. The isolation structure 40S is disposed betweenthe first semiconductor unit T1 and the second semiconductor unit T2 forproviding the isolation effect. The isolation structure 40S may includethe first part P1 disposed in the fin structure 10F and the second partP2 disposed on the first part P1 and the fin structure 10F because theisolation structure 40S may be formed by the method shown in FIGS. 2-6mentioned above, for example. The second part P2 is directly connectedto the first part P1, and the spacer 60S is disposed on the sidewall SW1of the second part P2 of the isolation structure 40S. The second part P2of the isolation structure 40S is disposed on the first fin F1 and thesecond fin F2 simultaneously in the vertical direction D3. In someembodiments, the first part P1 of the isolation structure 40S may besurrounded by a liner (not shown), and the second part P2 of theisolation structure 40S may be directly contact the spacer 60S, but notlimited thereto.

In a cross-sectional view of the semiconductor device 100 (such as FIG.10), the isolation structure 40S may include a T-shaped structure, andthe isolation structure 40S maybe regarded as a single diffusion break(SDB) structure, but not limited thereto. Additionally, thesemiconductor device 100 may further include the interlayer dielectric80. The interlayer dielectric 80 is disposed directly on the isolationstructure 40S, and the semiconductor device 100 shown in FIG. 10 mayberegarded as a condition before a replacement metal gate process forforming a metal gate structure at the location of the gate structure 50,but not limited thereto. In some embodiments, the first gate structure51 and the second gate structure 52 of the semiconductor device 100 maybe the gate electrode of the first semiconductor unit T1 and the gateelectrode of the second semiconductor unit T2 respectively, and thesemiconductor device 100 may be regarded as a semiconductor deviceincluding a plurality of fin type semiconductor units.

To summarize the above descriptions, in the semiconductor device and themanufacturing method thereof according to the present invention, thepullback process is used to enlarging the opening of the patterned masklayer after the step of forming the trench in the fin structure by theopening of the patterned mask layer, and the isolation structure isformed in the trench and the enlarged opening. Therefore, the secondpart of the isolation structure formed on the fin structure may beformed self-aligned with the first part of the isolation structureformed in the fin structure, and the isolation structure partly formedin the fin structure and partly formed on the fin structure as requiredmay be obtained accordingly. Additionally, based on the isolationstructure of the present invention, there is no need to form a gatestructure on the isolation structure. The negative influence of the gatestructure formed on the isolation structure may be avoided, and theisolation performance of the isolation structure may be ensuredaccordingly.

Those skilled in the art will readily observe that numerousmodifications and alterations of the device and method may be made whileretaining the teachings of the invention. Accordingly, the abovedisclosure should be construed as limited only by the metes and boundsof the appended claims.

What is claimed is:
 1. A semiconductor device, comprising: asemiconductor substrate, wherein the semiconductor substrate comprisesat least one fin structure; an isolation structure partly disposed inthe fin structure and partly disposed on the fin structure, wherein thefin structure comprises a first fin and a second fin, the first fin andthe second fin are elongated in a same direction, and a part of theisolation structure is disposed between the first fin and the second finin the direction where the first fin and the second fin are elongated;and a spacer disposed on sidewalls of the isolation structure disposedon the fin structure.
 2. The semiconductor device according to claim 1,wherein the isolation structure comprises: a first part disposed in thefin structure; and a second part disposed on the first part and the finstructure, wherein the second part is directly connected to the firstpart, and the spacer is disposed on sidewalls of the second part of theisolation structure.
 3. The semiconductor device according to claim 2,wherein the second part of the isolation structure is disposed on thefirst fin and the second fin.
 4. The semiconductor device according toclaim 1, wherein the isolation structure comprises a T-shaped structurein a cross-sectional view of the semiconductor device.
 5. Thesemiconductor device according to claim 1, further comprising: aninterlayer dielectric directly disposed on the isolation structure. 6.The semiconductor device according to claim 1, further comprising: afirst gate structure disposed on the first fin and disposed straddlingthe first fin; and a second gate structure disposed on the second finand disposed straddling the second fin, wherein the isolation structureis disposed between the first gate structure and the second gatestructure.
 7. The semiconductor device according to claim 6, wherein theisolation structure, the first gate structure, and the second gatestructure are parallel with one another.
 8. The semiconductor deviceaccording to claim 6, wherein the spacer is further disposed onsidewalls of the first gate structure and sidewalls of the second gatestructure.
 9. The semiconductor device according to claim 6, furthercomprising: a plurality of source/drain regions, wherein each of thesource/drain regions is at least partially disposed in the finstructure, a part of the source/drain regions are disposed on two sidesof the first gate structure in the direction where the first fin and thesecond fin are elongated, and another part of the source/drain regionsare disposed on two sides of the second gate structure in the directionwhere the first fin and the second fin are elongated.
 10. Thesemiconductor device according to claim 9, wherein some of thesource/drain regions are disposed between the isolation structure andthe first gate structure or disposed between the isolation structure andthe second gate structure in the direction where the first fin and thesecond fin are elongated.
 11. A method of manufacturing a semiconductordevice, comprising: providing a semiconductor substrate, wherein thesemiconductor substrate comprises at least one fin structure; forming apatterned mask layer on the fin structure, wherein the patterned masklayer comprises an opening corresponding to a part of the fin structurein a vertical direction; performing an etching process with thepatterned mask layer as a mask for forming a trench in the finstructure; performing a pullback process to the patterned mask layer forenlarging the opening of the patterned mask layer; and forming anisolation structure in the trench and the enlarged opening of thepatterned mask layer.
 12. The method of manufacturing the semiconductordevice according to claim 11, wherein the step of forming the isolationstructure comprises: forming an isolation material layer in the trench,in the enlarged opening of the patterned mask layer, and on thepatterned mask layer, wherein the enlarged opening and the trench arefilled with the isolation material layer; and performing a planarizationprocess to remove the isolation material layer on the patterned masklayer.
 13. The method of manufacturing the semiconductor deviceaccording to claim 11, wherein the isolation structure comprises: afirst part formed in the trench; and a second part formed on the firstpart and the fin structure, wherein the second part is directlyconnected to the first part.
 14. The method of manufacturing thesemiconductor device according to claim 13, wherein the fin structure isdivided into a first fin and a second fin by the trench, the first finand the second fin are elongated in a same direction, and the first partof the isolation structure is formed between the first fin and thesecond fin.
 15. The method of manufacturing the semiconductor deviceaccording to claim 14, wherein the second part of the isolationstructure is formed on the first fin and the second fin.
 16. The methodof manufacturing the semiconductor device according to claim 13, furthercomprising: forming a spacer on sidewalls of the first part of theisolation structure on the fin structure.
 17. The method ofmanufacturing the semiconductor device according to claim 16, furthercomprising: forming at least one gate structure straddling the finstructure, wherein the spacer is further formed on sidewalls of the gatestructure.
 18. The method of manufacturing the semiconductor deviceaccording to claim 17, wherein the gate structure and the isolationstructure are parallel to each other.
 19. The method of manufacturingthe semiconductor device according to claim 17, further comprising:forming a source/drain region in the fin structure between the gatestructure and the isolation structure.
 20. The method of manufacturingthe semiconductor device according to claim 11, wherein the pullbackprocess comprises a wet etching process for etching the patterned masklayer and enlarging the opening of the patterned mask layer.